AR0330 Datasheet, PDF (28/77 Pages) ON Semiconductor – CMOS Digital Image Sensor

AR0330: 1/3-Inch CMOS Digital Image Sensor
HiSPi Transmitter
V_CM
=
-^V---^C----^M----^--1----^---+-----^V----^C---^M----^---0---^-
2
(EQ 5)
V_CM = |V_CM (1)-V_CM (0) |
(EQ 6)
Both V_OD and V_CM are measured for all output channels. The worst case V_OD is defined
as the largest difference in V_OD between all channels regardless of logic level. And the
worst case V_CM is similarly defined as the largest difference in V_CM between all chan-
nels regardless of logic level.
Timing Definitions
1. Timing measurements are to be taken using the Square Wave test mode.
2. Rise and fall times are measured between 20% to 80% positions on the differential
waveform, as shown in Figure 10: “Single-Ended and Differential Signals,” on page 27.
3. Mean Clock-to-Data skew should be measured from the 0V crossing point on Clock to
the 0V crossing point on any Data channel regardless of edge, as shown in Figure 12
on page 28. This time is compared with the ideal Data transition point of 0.5UI with
the difference being the Clock-to-Data Skew (see Equation 7 on page 28).
Figure 12: Clock-to-Data Skew Timing Diagram
AR0330_DS Rev. U Pub. 4/15 EN
t_CHSKEWps
=
t – ^t--^p---^w-
2
(EQ 7)
t_CHSKEWUI
=
--^---^t- – 0.5
t_pw
(EQ 8)
4. The differential skew is measured on the two single-ended signals for any channel.
The time is taken from a transition on V_oa signal to corresponding transition on V_ob
signal at V_CM crossing point.
28
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