English
Language : 

AR0330 Datasheet, PDF (26/77 Pages) ON Semiconductor – CMOS Digital Image Sensor
AR0330: 1/3-Inch CMOS Digital Image Sensor
HiSPi Transmitter
Table 23: HiVCM Electrical AC Specification
Notes:
Parameter
Symbol
Min
Max
Unit
Notes
Data Rate
Bitrate Period
Max setup time from transmitter
Max hold time from transmitter
Eye Width
Data Total Jitter (pk-pk) @1e-9
Clock Period Jitter (RMS)
Clock Cycle-to-Cycle Jitter (RMS)
Rise time (20% - 80%)
Fall time (20% - 80%)
Clock duty cycle
Clock to Data Skew
PHY-to-PHY Skew
Mean differential skew
1/UI
tPW
tPRE
tPOST
tEYE
tTOTALJIT
tCKJIT
tCYCJIT
tR
tF
DCYC
tCHSKEW
tPHYSKEW
tDIFFSKEW
280
1.43
0.3
0.3
150ps
150ps
45
-0.1
-100
700
Mbps
1
3.57
ns
1
UI
1, 2
UI
1, 2
0.6
UI
1, 2
0.2
UI
1, 2
50
ps
2
100
ps
2
0.3
UI
3
0.3
UI
3
55
%
2
0.1
UI
1, 4
2.1
UI
1, 5
100
ps
6
1. One UI is defined as the normalized mean time between one edge and the following edge of the
clock.
2. Taken from the 0 V crossing point with the DLL off.
3. Also defined with a maximum loading capacitance of 10pF on any pin. The loading capacitance
may also need to be less for higher bitrates so the rise and fall times do not exceed the maximum
0.3 UI.
4. The absolute mean skew between the Clock lane and any Data Lane in the same PHY between any
edges.
5. The absolute mean skew between any Clock in one PHY and any Data lane in any other PHY
between any edges.
6. Differential skew is defined as the skew between complementary outputs. It is measured as the
absolute time between the two complementary edges at mean VCM point. Note that differential
skew also is related to the VCM_AC spec which also must not be exceeded.
Electrical Definitions
Figure 10 is the diagram defining differential amplitude VOD, VCM, and rise and fall
times. To measure VOD and VCM use the DC test circuit shown in Figure 11 on page 27
and set the HiSPi PHY to constant Logic 1 and Logic 0. Measure Voa, Vob and VCM with
voltmeters for both Logic 1 and Logic 0.
AR0330_DS Rev. U Pub. 4/15 EN
26
©Semiconductor Components Industries, LLC,2015.