GXM Datasheet, PDF (33/244 Pages) National Semiconductor (TI) – Geode™ GXm Processor Integrated x86 Solution with MMX Support

Signal Definitions (Continued)
2.2.6 Internal Test and Measurement Signals
Signal Name
BGA SPGA
Pin No. Pin No. Type
TMS
H1
N3
I
(PU)
(PU)
TEST
F3
J5
I
(PD)
(PD)
TDP
E24
F36
O
TDN
D26
E37
O
Description
Test Mode Select
JTAG test-mode select.
This pin is internally connected to a 20-kohm pull-up resistor.
Test
Test-mode input.
This pin is internally connected to a 20-kohm pull-down resistor.
Thermal Diode Positive
TDP is the positive terminal of the thermal diode on the die. The
diode is used to do thermal characterization of the device in a
system. This signal works in conjunction with TDN.
Thermal Diode Negative
TDN is the negative terminal of the thermal diode on the die. The
diode is used to do thermal characterization of the device in a
system. This signal works in conjunction with TDP.
Revision 3.1
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