M1A3P250-VQ100 Datasheet, PDF (9/210 Pages) Microsemi Corporation – ProASIC3 Flash Family FPGAs with Optional Soft ARM Support

ProASIC3 Flash Family FPGAs
VCC
VCC = 1.575 V
VCC = 1.425 V
Activation trip point:
V_a = 0.85 V ± 0.25 V
Deactivation trip point:
V_d = 0.75 V ± 0.25 V
VCC = VCCI + VT
where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
Region 1: I/O Buffers are OFF
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential
but slower because VCCI
is below specification. For the
same reason, input buffers do not
meet VIH / VIL levels, and output
buffers do not meet VOH / VOL levels.
Region 5: I/O buffers are ON
and power supplies are within
specification.
I/Os meet the entire datasheet
and timer specifications for
speed, VIH / VIL, VOH / VOL,
etc.
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI / VCC are below
specification. For the same reason, input
buffers do not meet VIH / VIL levels, and
output buffers do not meet VOH / VOL levels.
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification.
Region 1: I/O buffers are OFF
Activation trip point:
V_a = 0.9 V ± 0.3 V
Deactivation trip point:
V_d = 0.8 V ± 0.3 V
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
Figure 2-1 • I/O State as a Function of VCCI and VCC Voltage Levels
VCCI
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ can be used to calculate junction temperature.
T_J = Junction Temperature = ΔT + T_A
where:
T_A = Ambient Temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ_ja * P
θ_ja = Junction-to-ambient of the package. θ_ja numbers are located in Table 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ_jc and the junction-to-ambient air thermal resistivity is
θ_ja. The thermal characteristics for θ_ja are shown for two air flow rates.
Revision 15
2-4