M1A3P250-VQ100 Datasheet, PDF (10/210 Pages) Microsemi Corporation – ProASIC3 Flash Family FPGAs with Optional Soft ARM Support

ProASIC3 Flash Family FPGAs
The absolute maximum junction temperature is 100°C. EQ 1 shows a sample calculation of the absolute
maximum power dissipation allowed for a 484-pin FBGA package at commercial temperature and in still
air.
Maximum Power Allowed
=
M_-----a_----x_---._---j_--u_---n_---c_---t_--i_-o_----n_-----t_-e_----m_-----p_---._-----(_--°_---C_----)_{----–----}M_-----a_----x_---._---a_---m_-----b_----i_-e_---n_----t_---t_--e_---m_-----p_---._----(_--°_---C_----)_-
θ_ja(°C/W)
=
1_----0_--2-0_--0--°_--.-C5_{----°-–--C---}7_-/--W0----°_---C_--
=
1.463
W^·
EQ 1
Table 2-5 • Package Thermal Resistivities
Package Type
Quad Flat No Lead
Device
A3P030
θ_ja
Pin Count θ_jc Still Air 200 ft./min. 500 ft./min. Units
132
0.4 21.4
16.8
15.3
°C/W
A3P060
132
0.3 21.2
16.6
15.0
°C/W
A3P125
132
0.2 21.1
16.5
14.9
°C/W
A3P250
132
0.1 21.0
16.4
14.8
°C/W
Very Thin Quad Flat Pack (VQFP)
All devices
100 10.0 35.3
29.4
27.1
°C/W
Thin Quad Flat Pack (TQFP)
All devices
144 11.0 33.5
28.0
25.7
°C/W
Plastic Quad Flat Pack (PQFP)
All devices
208
8.0 26.1
22.5
20.8
°C/W
PQFP with embedded heatspreader All devices
208
3.8 16.2
13.3
Fine Pitch Ball Grid Array (FBGA)
See note^*
144
3.8 26.9
22.9
See note^*
256
3.8 26.6
22.8
See note^*
484
3.2 20.5
17.0
11.9
°C/W
21.5
°C/W
21.5
°C/W
15.9
°C/W
A3P1000
144
6.3 31.6
26.2
24.2
°C/W
A3P1000
256
6.6 28.1
24.4
22.7
°C/W
A3P1000
484
8.0 23.3
19.0
16.7
°C/W
Note: *This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
Revision 15
2-5