M1A3P250-VQ100 Datasheet, PDF (122/210 Pages) Microsemi Corporation – ProASIC3 Flash Family FPGAs with Optional Soft ARM Support

Package Pin Assignments
QN132 – Bottom View
D4
A36
B33
C30
A37
B34
C31
A48
B44
C40
Pin A1Mark
D1
A1
B1
C1
C21
B23
A25
C10
B11
A12
D3
C20
B22
A24
C11
B12
A13
D2
Optional
Corner Pad (4x)
Notes:
1. The die attach paddle center of the package is tied to ground (GND).
2. Option corner pads come with this device and package combination. It is optional to tie them to ground or leave them
floating.
3. The QN132 package is discontinued and is not available for ProASIC3 devices. For Package Manufacturing and
Environmental information, visit the Resource Center at:
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
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Revision 15