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| PIC18F1XK22 Datasheet, PDF (347/388 Pages) Microchip Technology – 20-Pin Flash Microcontrollers with nanoWatt XLP Technology | |||
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PIC18F1XK22/LF1XK22
25.11 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ï£ TA ï£ +125°C
Param
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01 ï±JA
Thermal Resistance Junction to Ambient 62.4
ï°C/W 20-pin PDIP package
85.2
ï°C/W 20-pin SOIC package
108.1
ï°C/W 20-pin SSOP package
40
ï°C/W 20-pin QFN 4x4mm package
TH02 ï±JC
Thermal Resistance Junction to Case
31.4
ï°C/W 20-pin PDIP package
24
ï°C/W 20-pin SOIC package
24
ï°C/W 20-pin SSOP package
2.5
ï°C/W 20-pin QFN 4x4mm package
TH03 TJMAX
Maximum Junction Temperature
150
ï°C
TH04 PD
Power Dissipation
TH05 PINTERNAL Internal Power Dissipation
â
W
PD = PINTERNAL + PI/O
â
W
PINTERNAL = IDD x VDD(1)
TH06 PI/O
TH07 PDER
I/O Power Dissipation
Derated Power
â
W
PI/O = ï (IOL * VOL) + ï (IOH * (VDD - VOH))
â
W
PDER = PDMAX (TJ - TA)/ï±JA(2)
Legend: TBD = To Be Determined
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature.
3: TJ = Junction Temperature.
ï£ 2010 Microchip Technology Inc.
Preliminary
DS41365D-page 347
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