LTC3882_15 Datasheet, PDF (103/104 Pages) Linear Technology – Dual Output PolyPhase Step-Down DC/DC Voltage Mode Controller with Digital Power System Management

PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UJ Package
40-Lead Plastic QFN (6mm × 6mm)
(Reference LTC DWG # 05-08-1728 Rev Ø)
0.70 ±0.05
LTC3882
4.42 ±0.05
4.42 ±0.05
6.50 ±0.05
5.10 ±0.05
4.50 ±0.05
(4 SIDES)
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
PACKAGE OUTLINE
6.00 ±0.10
(4 SIDES)
PIN 1 TOP MARK
(SEE NOTE 6)
0.75 ±0.05
R = 0.10
TYP
4.50 REF
(4-SIDES)
R = 0.115
TYP
39 40
4.42 ±0.10
PIN 1 NOTCH
R = 0.45 OR
0.35 × 45°
CHAMFER
0.40 ±0.10
1
2
4.42 ±0.10
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.25 ±0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
(UJ40) QFN REV Ø 0406
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconneFcotiornmoof irtseciinrcfouirtms aastdioenscwribwedwh.leinreeinarw.cilol nmot/LinTfCrin3g8e8o2n existing patent rights.
3882f
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