XP2 Datasheet, PDF (49/92 Pages) Lattice Semiconductor – LatticeXP2 Family Data Sheet

Lattice Semiconductor
DC and Switching Characteristics
LatticeXP2 Family Data Sheet
Programming and Erase Flash Supply Current^{1, 2, 3, 4, 5}
Over Recommended Operating Conditions
Symbol
Parameter
Device
Typical
(25°C, Max. Supply)⁶
Units
XP2-5
17
mA
XP2-8
21
mA
I_CC
Core Power Supply Current
XP2-17
XP2-30
28
mA
36
mA
XP2-40
50
mA
XP2-5
64
mA
XP2-8
66
mA
I_CCAUX
Auxiliary Power Supply Current⁷
XP2-17
XP2-30
83
mA
87
mA
XP2-40
88
mA
I_CCPLL
PLL Power Supply Current (per PLL)
0.1
mA
I_CCIO
Bank Power Supply Current (per Bank)
5
mA
I_CCJ
V_CCJ Power Supply Current⁸
14
mA
1. For further information on supply current, please see TN1139, Power Estimation and Management for LatticeXP2 Devices.
2. Assumes all outputs are tristated, all inputs are configured as LVCMOS and held at the V_CCIO or GND.
3. Frequency 0MHz (excludes dynamic power from FPGA operation).
4. A specific configuration pattern is used that scales with the size of the device; consists of 75% PFU utilization, 50% EBR, and 25% I/O con-
figuration.
5. Bypass or decoupling capacitor across the supply.
6. T_J = 25°C, power supplies at nominal voltage.
7. In fpBGA and ftBGA packages the PLLs are connected to and powered from the auxiliary power supply. For these packages, the actual
auxiliary supply current is the sum of I_CCAUX and I_CCPLL. For csBGA, PQFP and TQFP packages the PLLs are powered independent of the
auxiliary power supply.
8. When programming via JTAG.
3-5