HYB25D512800BT Datasheet, PDF (88/90 Pages) Infineon Technologies AG – 512Mbit Double Data Rate SDRAM

HYB25D512[40/16/80]0B[E/F/C/T]
512Mbit Double Data Rate SDRAM
Package Outlines
8
Package Outlines
There are two package types used for this product family each in lead-free and lead-containing assembly:
• P-TFBGA: Plastic Thin Fine-Pitch Ball Grid Array Package
Table 28 TFBGA Common Package Properties (non-green/green)
Description
Size
Units
Ball Size
0.460
mm
Recommended Landing Pad
0.350
mm
Recommended Solder Mask
0.450
mm
• P-TSOPII: Plastic Thin Small Outline Package Type II
12
11 x 1 = 11
1
0.18 MAX.
0.2
2)
B
1) 5)
2)
A
4)
3)
ø0.46 ±0.05
0.1 C
0.1 C
60x
ø0.15 M
ø0.08 M
C
A
B
C SEATING PLANE
Figure 54
1) Dummy Pads without Ball
2) Middle of Packages Edges
3) Package Orientation Mark A1
4) Bad Unit Marking (BUM)
5) Die Sort Fiducial
Package Outline of P-TFBGA-60-[9/22] (green/non-green)
GPA09554
Data Sheet
88
Rev. 1.2, 2004-06