HD404669 Datasheet, PDF (6/142 Pages) Hitachi Semiconductor – Low-Voltage AS Microcomputers with On-Chip DTMF Generation Circuit

HD404669 Series
Bonding Pad Coordinates
HCD404669
Y
TYPE
CODE
Chip center
(X=0, Y=0)
Chip Size (X × Y): 4.34 × 4.01 (mm)
Coordinates: Pad Center
Home Point position: Chip Center
X
Pad size (X × Y): 90 × 90 (µm)
Chip thickness: 400 (µm)
Pad Pad
No. Name
1 RE0
2 TESTN
3 OSC1
4 OSC2
5 RESET
6 X1
7 X2
8 GND
9 D0
10 D1
11 D2
12 D3
13 D4
14 D5
15 D9
16 D10
Coordinates
X
Y
Pad Pad
No. Name
–1983 1444 17 D11
–1983 1252 18 D12
–1983 1062 19 D13
–1983 871 20 R00
–1983 657 21 R01
–1983 466 22 R02
–1983 275 23 R03
–1983
84 24 R10
–1983 –108 25 R11
–1983 –299 26 R12
–1983 –490 27 R13
–1983 –680 28 R20
–1983 –871 29 R21
–1983 –1062 30 R22
–1983 –1253 31 R23
–1983 –1444 32 R30
Coordinates
X
Y
–1607 –1819
–1394 –1819
–1181 –1819
–968 –1819
–755 –1819
–541 –1819
–329 –1819
–117 –1819
96 –1819
309 –1819
522 –1819
735 –1819
948 –1819
1161 –1819
1374 –1819
1587 –1819
Pad Pad
No. Name
33 R33
34 R32
35 R31
36 R40
37 R41
38 R42
39 R43
40 R60
41 R61
42 R62
43 R63
44 R70
45 R71
46 R72
47 R73
48 R80
Coordinates
X
Y
1983 –1444
1983 –1252
1983 –1060
1983 –867
1983 –675
1983 –483
1983 –291
1983 –99
1983
93
1983 285
1983 478
1983 670
1983 862
1983 1054
1983 1246
1983 1444
Pad Pad
No. Name
49 R81
50 R82
51 R83
52 R90
53 R91
54 R92
55 R93
56 RA0
57 RA1
58 SEL
59 V_CC
60 TONEC
61 TONER
62 VTREF
63 RD0
64 RD1
Coordinates
X
Y
1587 1819
1374 1819
1161 1819
948 1819
735 1819
522 1819
309 1819
93 1819
–177 1819
–329 1819
–542 1819
–755 1819
–968 1819
–1181 1819
–1394 1819
–1607 1819
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