MB86294 Datasheet, PDF (305/305 Pages) Fujitsu Component Limited. – Grraphiics Controller specifications

FUJITSU SEMICONDUCTOR
DATA SHEET
QUAD FLAT PACKAGE
256 PIN PLASTIC
FPT-256P-M09
256-pin plastic QFP
(FPT-256P-M09)
Lead pitch
Package width ×
package length
Lead shape
0.40 mm
28.0 × 28.0 mm
Gullwing
Sealing method
Plastic mold
Mounting height
4.03 mm MAX
Weight
5.74g
Remark
Low heat resistance type
Code(Reference) P-FQFP256-28 × 28-0.40
256-pin plastic QFP
(FPT-256P-M09)
30.60±0.20(1.205±.008)SQ
28.00±0.10(1.102±.004)SQ
192
193
∗Pins width and pins thickness include plating thickness.
129
128
0.145±0.055
(.006±.002)
INDEX
256
LEAD No. 1
0.40(.016)
65
0.18±0.05
(.007±.002)
64
0.07(.003) M
0.08(.003)
Details of "A" part
3.73±0.30
(.147±.012)
(Mounting height)
0˚~8˚
0.40
+0.10
–0.15
.016
+.004
–.006
(Stand off)
"A"
(0.50(.020))
0.60±0.15
(.024±.006)
0.25(.010)
C _{2000 FUJITSU LIMITED F256025S-c-2-3}
Dimensions in mm (inches).
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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