MB86294 Datasheet, PDF (304/305 Pages) Fujitsu Component Limited. – Grraphiics Controller specifications

FUJITSU SEMICONDUCTOR
DATA SHEET
BGA-256P-M02
256-pin plastic BGA
BALL GRID ARRAY PACKAGE
256 PIN PLASTIC
Lead pitch
Pin matrix
Sealing method
50 mil
20
Plastic mold
(BGA-256P-M02)
256-pin plastic BGA
(BGA-256P-M02)
27.00±0.20(1.06±.008)SQ
24.00±0.10(.94±.004)
Note: The actual shape of corners may differ from the dimension.
2.30±0.20
(.091±.008)
0.60±0.10
(.024±.004)
24.13±0.20(.95±.008)
INDEX
1.27±0.20
(.05±.008)
0.15(.006)
Ø0.75±0.15(Ø.03±.006)
1 PIN
C _{1995 FUJITSU LIMITED BGA256004SC-2-1}
Dimensions in mm (inches).
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.
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