MB86831 Datasheet, PDF (22/82 Pages) Fujitsu Component Limited. – 32-bit Embedded Controller

MB86830 Series
(Notes on Board Wiring)
• For connecting the power supply and ground (GND), use multiple VDD and VSS pins. The system board based
on the MB86830 series must be a multilayer board containing power supply (VDD) and GND (VSS) layers for
stable power supply. Leave any pin designated as “N.C.” unconnected.
• Insert sufficient decoupling capacitors near the MB86830 series. Changes to the output levels of many of the
output pins on the MB86830 series (in particular, those with large load capacitance) may cause variation in
power supply.
• For those systems which run at a high frequency, low-inductance capacitors and mutual wiring are recom-
mended. Inductance can be lowered by shortening the distance between the processor and decoupling
capacitor.
• For system reliability, the pin entering the tristate when the MB86830 series enters the bus grant state should
be driven by a bus master. In particular, the LOCK#, ADR<27:2>, ASI<3:0> (ASI<3:0>/ADR<28:31>, ASI<3:0>
/ADR<24:27>), BE0# to BE3#, D<31:0>, AS#, and RDWR# pins must be driven by other bus masters. Usually,
these pins require no external pull-up resistor because they are driven by the processor when the processor
is active or idle.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage,
current,temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
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