MC68HC05X16 Datasheet, PDF (170/232 Pages) Freescale Semiconductor, Inc – High-density complementary metal oxide semiconductor HCMOS) microcontroller unit

Freescale Semiconductor, Inc.
13.2
64-pin quad flat pack (QFP) mechanical dimensions
13
L
48
49
33
32
-A-
L
Case No. 840C
64 lead QFP
-B-
B
V
B
B
P
- A, B, D -
Detail “A”
F
Detail “A”
64
17
1
16
-D-
A
0.20 M C A – BS D S
0.05 A – B
S
0.20 M H A – BS D S
Detail “C”
E
M
J
N
D
Section B–B
Base
Metal
0.20 M C A – BS D S
U
T
R
C
-C-
H
G
Seating
Plane
-H-
Datum
Plane
M
Q
K
W
X
Dim.
A
B
C
D
E
F
G
H
J
K
L
Min. Max.
13.90 14.10
13.90 14.10
2.067 2.457
0.30 0.45
2.00 2.40
0.30 —
0.80 BSC
0.067 0.250
0.130 0.230
0.50 0.66
12.00 REF
Notes
1. Datum Plane –H– is located at bottom of lead and is coincident with
the lead where the lead exits the plastic body at the bottom of the
parting line.
2. Datums A–B and –D to be determined at Datum Plane –H–.
3. Dimensions S and V to be determined at seating plane –C–.
4. Dimensions A and B do not include mould protrusion. Allowable
mould protrusion is 0.25mm per side. Dimensions A and B do
include mould mismatch and are determined at Datum Plane –H–.
5. Dimension D does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 total in excess of the D dimension
at maximum material condition. Dambar cannot be located on the
lower radius or the foot.
6. Dimensions and tolerancing per ANSI Y 14.5M, 1982.
7. All dimensions in mm.
Dim.
M
N
P
Q
R
S
T
U
V
W
X
Min. Max.
5° 10°
0.130 0.170
0.40 BSC
2°
8°
0.13 0.30
16.20 16.60
0.20 REF
9° 15°
16.20 16.60
0.042 NOM
1.10 1.30
Figure 13-2 64-pin QFP mechanical dimensions
MECHANICAL DATA
MC68HC05X16
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Rev. 1
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