MC9S12UF32 Datasheet, PDF (125/128 Pages) Freescale Semiconductor, Inc – System on a Chip Guide V01.05

B.3 64-pin LQFP Package
System on a Chip Guide — 9S12UF32DGV1/D V01.05
4X
0.2 H A–B D
64
1
4X 16 TIPS
0.2 C A–B D
49
48
A
B
3X
VIEW Y
E1 E
A1
E1/2
E/2
16
17
33
32
D
D1/2
D/2
D1
D
HA
C
SEATING
PLANE
4X (θ2)
4X (θ3)
0.08 C
VIEW AA
X
X=A, B OR D
CL
AB
AB
VIEW Y
e/2
60X e
BASE METAL
b1
c
c1
PLATING
b
0.08 M C A–B D
SECTION AB–AB
ROTATED 90° CLOCKWISE
A2
0.05 S
(S)
2X R R1
θ1
0.25
θ
GAGE PLANE
(L2)
L
(L)
VIEW AA
NOTES:
1. ALL DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE H IS COINCIDENT WITH THE
BOTTOM OF THE LEAD WHERE THE LEAD EXITS
THE PLASTIC BODY AT THE BOTTOM OF THE
PARTING LINE.
4. DATUMS A, B AND D TO BE DETERMINED AT
DATUM PLANE H.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE C.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
PER SIDE. DIMENSIONS D1 AND E1 DO INCLUDE
MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE H.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. THE DAMBAR PROTRUSION
SHALL NOT CAUSE THE b DIMENSION TO
EXCEED 0.35. MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07.
MILLIMETERS
DIM MIN MAX
A — 1.60
A1 0.05 0.15
A2 1.35 1.45
b 0.17 0.27
b1 0.17 0.23
c 0.09 0.20
c1 0.09 0.16
D 12.00 BSC
D1 10.00 BSC
e
0.50 BSC
E
12.00 BSC
E1 10.00 BSC
L 0.45 0.75
L1 1.00 REF
L2 0.50 REF
R1 0.10 0.20
S
0.20 REF
θ
0°
7°
θ1 0°
—
θ2
12° REF
θ3
12° REF
Figure B-2 64-pin LQFP mechanical dimensions (case no. 840F)
Freescale Semiconductor
125