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LM3S1621 Datasheet, PDF (9/947 Pages) Texas Instruments – ARM and Thumb are registered trademarks and Cortex is a trademark
Stellaris® LM3S1621 Microcontroller
21.9 Sleep Modes ............................................................................................................... 894
21.10 Hibernation Module ..................................................................................................... 894
21.11 Flash Memory ............................................................................................................. 896
21.12 Input/Output Characteristics ......................................................................................... 896
21.13 External Peripheral Interface (EPI) ............................................................................... 897
21.14 Analog-to-Digital Converter (ADC) ................................................................................ 902
21.15 Synchronous Serial Interface (SSI) ............................................................................... 903
21.16 Inter-Integrated Circuit (I2C) Interface ........................................................................... 905
21.17 Analog Comparator ..................................................................................................... 906
21.18 Current Consumption .................................................................................................. 906
21.18.1 Nominal Power Consumption ....................................................................................... 906
21.18.2 Maximum Current Consumption ................................................................................... 907
A Register Quick Reference ................................................................................... 909
B Ordering and Contact Information ..................................................................... 935
B.1 Ordering Information .................................................................................................... 935
B.2 Part Markings .............................................................................................................. 935
B.3 Kits ............................................................................................................................. 936
B.4 Support Information ..................................................................................................... 936
C
C.1
C.1.1
C.1.2
C.1.3
C.2
C.2.1
C.2.2
C.2.3
Package Information ............................................................................................ 937
100-Pin LQFP Package ............................................................................................... 937
Package Dimensions ................................................................................................... 937
Tray Dimensions ......................................................................................................... 939
Tape and Reel Dimensions .......................................................................................... 939
108-Ball BGA Package ................................................................................................ 941
Package Dimensions ................................................................................................... 941
Tray Dimensions ......................................................................................................... 943
Tape and Reel Dimensions .......................................................................................... 944
January 21, 2012
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Texas Instruments-Production Data