LM3S1621 Datasheet, PDF (32/947 Pages) Texas Instruments – ARM and Thumb are registered trademarks and Cortex is a trademark

Revision History
Table 1. Revision History (continued)
Date
September 2010
Revision Description
7794
■ Reorganized ARM Cortex-M3 Processor Core, Memory Map and Interrupts chapters, creating two
new chapters, The Cortex-M3 Processor and Cortex-M3 Peripherals. Much additional content was
added, including all the Cortex-M3 registers.
■ Changed register names to be consistent with StellarisWare^® names: the Cortex-M3 Interrupt
Control and Status (ICSR) register to the Interrupt Control and State (INTCTRL) register, and
the Cortex-M3 Interrupt Set Enable (SETNA) register to the Interrupt 0-31 Set Enable (EN0)
register.
■ In the System Control chapter:
– Corrected Reset Sources table (see Table 5-3 on page 181).
– Added section "Special Considerations for Reset."
■ In the Hibernation Module chapter, added section "Special Considerations When Using a
4.194304-MHz Crystal".
■ In the Internal Memory chapter:
– Added clarification of instruction execution during Flash operations.
– Deleted ROM Version (RMVER) register as it is not used.
■ Modified Figure 9-1 on page 401 and Figure 9-2 on page 402 to clarify operation of the GPIO inputs
when used as an alternate function.
■ Corrected GPIOAMSEL bit field in GPIO Analog Mode Select (GPIOAMSEL) register to be eight-bits
wide, bits[7:0].
■ In General-Purpose Timers chapter, clarified operation of the 32-bit RTC mode.
■ In Operating Characteristics chapter, corrected Thermal resistance (junction to ambient) value to
32.
■ In Electrical Characteristics chapter:
– Added "Input voltage for a GPIO configured as an analog input" value to Table 21-1 on page 886.
– Added I_LKG parameter (GPIO input leakage current) to Table 21-20 on page 896.
– Corrected Nom values for I_{HIB_NORTC} and I_{HIB_RTC} in Table 21-32 on page 906.
– Corrected reset timing in Table 21-5 on page 890.
– Corrected values for t_{WAKE_TO_HIB} in Table 21-18 on page 895.
– Specified Max value for V_REFA in Table 21-26 on page 903.
– Corrected values for t_CLKRF (SSIClk rise/fall time) in Table 21-28 on page 903.
– Added I²C Characteristics table (see Table 21-29 on page 905).
■ Added dimensions for Tray and Tape and Reel shipping mediums.
June 2010
7413 ■ In "Thermal Characteristics" table, corrected thermal resistance value from 34 to 32.
32
January 21, 2012
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