MSP430FR5729 Datasheet, PDF (14/115 Pages) Texas Instruments – MSP430FR572x Mixed-Signal Microcontrollers

MSP430FR5729, MSP430FR5728, MSP430FR5727, MSP430FR5726, MSP430FR5725
MSP430FR5724, MSP430FR5723, MSP430FR5722, MSP430FR5721, MSP430FR5720
SLASE35A – MAY 2014 – REVISED JUNE 2014
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5 Specifications
5.1 Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Voltage applied at V_CC to V_SS
Voltage applied to any pin (excluding VCORE) ⁽²⁾
Diode current at any device pin
–0.3 V to 4.1 V
–0.3 V to V_CC + 0.3 V
±2 mA
Maximum junction temperature, T_J
95°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V_SS. V_CORE is for internal device use only. No external DC loading or voltage should be applied.
5.2 Handling Ratings
MIN
MAX
UNIT
T_stg
Storage temperature range^{(1) (2) (3)}
-55
125
°C
(1) Data retention on FRAM memory cannot be ensured when exceeding the specified maximum storage temperature, T_stg.
(2) For soldering during board manufacturing, it is required to follow the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
(3) Programming of devices with user application code should only be performed after reflow or hand soldering. Factory programmed
information, such as calibration values, are designed to withstand the temperatures reached in the current JEDEC J-STD-020
specification.
5.3 Recommended Operating Conditions
Typical values are specified at V_CC = 3.3 V and T_A = 25°C (unless otherwise noted)
V_CC
V_SS
T_A
T_J
C_VCORE
C_VCC/
C_VCORE
f_SYSTEM
Supply voltage during program execution and FRAM programming (AVCC = DVCC) ⁽¹⁾
Supply voltage (AVSS = DVSS)
Operating free-air temperature
Operating junction temperature
Required capacitor at VCORE⁽²⁾
Capacitor ratio of VCC to VCORE
Processor frequency (maximum MCLK frequency)⁽³⁾
No FRAM wait states⁽⁴⁾,
2 V ≤ V_CC ≤ 3.6 V
MIN NOM MAX UNIT
2.0
3.6 V
0
V
-40
85 °C
-40
85 °C
470
nF
10
0
8.0 MHz
(1) It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
(2) A capacitor tolerance of ±20% or better is required.
(3) Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
(4) When using manual wait state control, see the MSP430FR57xx Family User's Guide (SLAU272) for recommended settings for common
system frequencies.
14
Specifications
Copyright © 2014, Texas Instruments Incorporated
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Product Folder Links: MSP430FR5729 MSP430FR5728 MSP430FR5727 MSP430FR5726 MSP430FR5725
MSP430FR5724 MSP430FR5723 MSP430FR5722 MSP430FR5721 MSP430FR5720