GS2961A Datasheet, PDF (103/104 Pages) Gennum Corporation – Ancillary data extraction

7.4 Solder Reflow Profiles
The GS2961A is available in a Pb-free package. It is recommended that the Pb-free
package be soldered with Pb-free paste using the reflow profile shown in Figure 7-1.
Temperature
260°C
250°C
217°C
200°C
3°C/sec max
60-150 sec.
20-40 sec.
6°C/sec max
150°C
25°C
60-180 sec. max
8 min. max
Figure 7-1:Pb-free Solder Reflow Profile
7.5 Ordering Information
Part Number
GS2961AIBE3
Package
100-ball BGA
Pb-free
Yes
Time
Temperature Range
-20°C to 85°C
Revision History
Version
2
1
ECR
158468
154880
PCN
–
–
0
153769
–
Date
September 2012
September 2010
May 2010
Changes and/or Modifications
Changes throughout the document.
Defined bits NONINV (001h-14) and
DISB_AUTDET (001h-13) in Table 4-18
Configuration and Status Registers.
New Document.
GS2961A 3Gb/s, HD, SD SDI Integrated Receiver
Data Sheet
54385 - 2
September 2012
103 of 104