GS2961A Datasheet, PDF (101/104 Pages) Gennum Corporation – Ancillary data extraction

7. Package & Ordering Information
7.1 Package Dimensions
TOP VIEW
PIN 1 CORNER
A
B
C
D
E
F
G
H
J
K
1 2 3 4 5 6 7 8 9 10
C
SEATING PLANE
*THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS
ARE DIFFERENT FROM JEDEC SPEC M0192 (LOW PROFILE BGA FAMILY)
BOTTOM VIEW
Φ0.10 C
Φ0.25 C A B
Φ0.40~0.60(100X)
PIN 1 CORNER
10 9 8 7 6 5 4 3 2 1
B
A
0.20(4X)
A
B
C
D
E
F
G
H
J
K
1.00
9.00
11±0.10
Ball Pitch:
Ball Diameter:
Substrate Thickness:
1.00
0.366
Mold Thickness:
0.50
0.70
PACKAGE OUTLINE
100L LBGA
PACKAGE SIZE: 11 x 11 x 1.71mm
GS2961A 3Gb/s, HD, SD SDI Integrated Receiver
Data Sheet
54385 - 2
September 2012
101 of 104