GS2961A Datasheet, PDF (102/104 Pages) Gennum Corporation – Ancillary data extraction

7.2 Packaging Data
Table 7-1: Packaging Data
Parameter
Value
Package Type
Package Drawing
Reference
Moisture Sensitivity Level
Junction to Case Thermal
Resistance, θ_j-c
Junction to Air Thermal
Resistance, θ_j-a (at zero
airflow)
Junction to Board
Thermal Resistance, θ_j-b
Psi, ψ
Pb-free and RoHS
Compliant
11mm x 11mm 100-ball LBGA
JEDEC M0192 (with exceptions noted in Package Dimensions on
page 101).
3
15.4°C/W
37.1°C/W
26.4°C/W
0.4°C/W
Yes
7.3 Marking Diagram
Pin 1 ID
GS2961A
XXXXE3
YYW W
XXXX - Last 4 digits (excluding decimal)
of SAP Batch Assembly (FIN) as listed
on Packing Slip.
E3 - Pb-free & Green indicator
YYWW - Date Code
GS2961A 3Gb/s, HD, SD SDI Integrated Receiver
Data Sheet
54385 - 2
September 2012
102 of 104