SE97 Datasheet, PDF (50/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 44. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Abbreviations
Table 33. Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
ARA
Alert Response Address
CDM
Charged-Device Model
CMOS
Complementary Metal-Oxide Semiconductor
CPU
Central Processing Unit
DDR
Double Data Rate
DIMM
Dual In-line Memory Module
DRAM
Dynamic Random Access Memory
ECC
Error-Correcting Code
EEPROM
Electrically Erasable Programmable Read-Only Memory
ESD
ElectroStatic Discharge
HBM
Human Body Model
I²C-bus
Inter-Integrated Circuit bus
LSB
Least Significant Bit
MM
Machine Model
MSB
Most Significant Bit
PC
Personal Computer
PCB
Printed-Circuit Board
POR
Power-On Reset
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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