SE97 Datasheet, PDF (37/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
11. Characteristics
Table 28. SE97 thermal sensor characteristics
V_DD = 3.0 V to 3.6 V; T_amb = −40 °C to +125 °C; unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
T_lim(acc) temperature limit accuracy
T_res
temperature resolution
B grade; V_DD = 3.3 V ± 10 %
T_amb = 75 °C to 95 °C
T_amb = 40 °C to 125 °C
T_amb = −40 °C to +125 °C
−1.0
< ±0.5 +1.0
°C
−2.0
< ±1.0 +2.0
°C
−3.0
< ±2
+3.0
°C
-
0.125 -
°C
T_conv
conversion period
conversion time from STOP bit
-
to conversion complete
100
120
ms
E_f(conv)
conversion rate error
percentage error in
programmed data
−30
-
+30
%
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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