SE97 Datasheet, PDF (46/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
HXSON8: plastic thermal enhanced extremely thin small outline package; no leads;
8 terminals; body 2 x 3 x 0.5 mm
X
b
D
vM A B
BA
SOT1052-1
E
terminal 1
index area
terminal 1
e
index area
1
L
1/2 e
4
E_h
A
A₁
detail X
y₁ C
(8×)
C
y
8
5
D_h
DIMENSIONS (mm are the original dimensions)
0
1
2 mm
scale
UNIT
A⁽¹⁾ A₁
b
D
D₁
E
E₁
e
L
v
y
y₁
max 0.5 0.04 0.3 2.1 1.6 3.1 1.6
0.45
mm nom
2.0
3.0
0.5
0.1 0.05 0.05
min
0.2 1.9 1.4 2.9 1.4
0.35
Note
1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT1052-1
MO-229
EUROPEAN
PROJECTION
ISSUE DATE
08-01-11
08-03-11
Fig 42. Package outline SOT1052-1 (HXSON8)
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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