SE97 Datasheet, PDF (45/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 x 3 x 0.85 mm
SOT908-1
X
D
BA
0
1
2 mm
scale
terminal 1
index area
terminal 1
index area
L
e₁
e
1
b
4
E
A
A₁
c
detail X
vM CA B
wM C
y₁ C
C
y
exposed tie bar (4×)
E_h
exposed tie bar (4×)
8
5
D_h
DIMENSIONS (mm are the original dimensions)
UNIT ^A(1)
max.
A1
b
c
D⁽¹⁾ Dh E⁽¹⁾ Eh
e
e1
L
v
w
y
y1
mm
1
0.05 0.3
0.00 0.2
0.2
3.1
2.9
2.25
1.95
3.1
2.9
1.65
1.35
0.5
1.5
0.5
0.3
0.1 0.05 0.05 0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT908-1
MO-229
ISSUE DATE
05-09-26
05-10-05
Fig 41. Package outline SOT908-1 (HVSON8)
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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