SE97 Datasheet, PDF (44/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
12. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 4.4 mm
SOT530-1
D
c
y
Z
8
5
E
A
X
HE
vM A
pin 1 index
A2
A1
1
e
4
bp
wM
(A3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ E⁽²⁾
e
HE
L
Lp
mm
1.1
0.15
0.05
0.95
0.85
0.25
0.30
0.19
0.20
0.13
3.1
2.9
4.5
4.3
0.65
6.5
6.3
0.94
0.7
0.5
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT530-1
MO-153
v
w
y
Z⁽¹⁾
θ
0.1
0.1
0.1
0.70
0.35
8°
0°
EUROPEAN
PROJECTION
ISSUE DATE
00-02-24
03-02-18
Fig 40. Package outline SOT530-1 (TSSOP8)
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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