SE97 Datasheet, PDF (3/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
3. Applications
I DDR2 and DDR3 memory modules
I Laptops, personal computers and servers
I Enterprise networking
I Hard disk drives and other PC peripherals
4. Ordering information
Table 1. Ordering information
Type number Topside Package
mark
Name
SE97PW
SE97
TSSOP8
SE97TK
SE97
HVSON8
SE97TL^[1]
97L
HXSON8
SE97TP^[1][2] S97
HWSON8
Description
plastic thin shrink small outline package; 8 leads;
body width 4.4 mm
plastic thermal enhanced very thin small outline package;
no leads; 8 terminals; body 3 × 3 × 0.85 mm
plastic thermal enhanced extremely thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.5 mm
plastic thermal enhanced very very thin small outline package;
no leads; 8 terminals; body 2 × 3 × 0.8 mm
Version
SOT530-1
SOT908-1
SOT1052-1
SOT1069-1
[1] SE97TL and SE97TP offer improved V_POR/EVENT I_OL.
[2] Industry standard 2 mm × 3 mm × 0.8 mm package to JEDEC VCED-3 PSON8 in 8 mm × 4 mm pitch tape 4 k quantity reels.
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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