SE97 Datasheet, PDF (47/54 Pages) NXP Semiconductors – DDR memory module temp sensor with integrated SPD, 3.3 V

NXP Semiconductors
SE97
DDR memory module temp sensor with integrated SPD, 3.3 V
HWSON8: plastic thermal enhanced very very thin small outline package; no leads;
8 terminals; body 2 x 3 x 0.8 mm
X
b
vM A B
D
BA
SOT1069-1
E
A
A₁
terminal 1
index area
terminal 1
e
index area
1
L
1/2 e
4
detail X
y₁ C
C
y
(8×)
E_h
8
D_h
DIMENSIONS (mm are the original dimensions)
5
0
1
scale
2 mm
UNIT
A⁽¹⁾ A₁
b
D
D₁
E
E₁
e
L
v
y
y₁
max 0.8 0.04 0.3 2.1 1.6 3.1 1.6
0.45
mm nom
2.0
3.0
0.5
0.1 0.05 0.05
min
0.2 1.9 1.4 2.9 1.4
0.35
Note
1. Dimension A is including plating thickness. The package footprint is compatible with JEDEC MO229
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT1069-1
MO-229
EUROPEAN
PROJECTION
ISSUE DATE
08-06-11
08-07-10
Fig 43. Package outline SOT1069-1 (HWSON8)
SE97_5
Product data sheet
Rev. 05 — 6 August 2009
© NXP B.V. 2009. All rights reserved.
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