GR442QR7LB102KW01L Datasheet, PDF (232/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice
C02E.pdf
Oct.1,2012
c Rating
1. Capacitance Change of Capacitor
Capacitors have an aging characteristic, whereby
the capacitor continually decreases its capacitance
slightly if the capacitor is left on for a long time.
Moreover, capacitance might change greatly depending
on the surrounding temperature or an applied voltage.
Therefore, it is not likely to be suitable for use in a time
constant circuit.
Please contact us if you need detailed information.
2. Performance Check by Equipment
Before using a capacitor, check that there is no problem
in the equipment's performance and the specifications.
Generally speaking, CLASS 2 ceramic capacitors have
voltage dependence characteristics and temperature
dependence characteristics in capacitance.
Therefore, the capacitance value may change depending
on the operating condition in the equipment.
Accordingly, be sure to confirm the apparatus
performance of receiving influence in a capacitance
value change of a capacitor, such as leakage current
and noise suppression characteristics.
Moreover, check the surge-proof ability of a capacitor in
the equipment, if needed, because the surge voltage may
exceed the specific value by the inductance of the circuit.
c Soldering and Mounting
1. Construction of Board Pattern
If solder is excessively applied to the circuit board,
mechanical stress will cause destruction resistance
characteristics to lower. To prevent this, be extremely
careful in determining shape and dimension before
designing the circuit board diagram.
Construction and Dimensions of Pattern (Example)
Chip Capacitor
c
Solder Resist
b
a
Part Number
a
Kpp31
1.6
Kpp55
2.6
Land
b
1.8
2.7
c
1.9
5.6
(in mm)
2. Mounting of Chips
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips and the metal to bend. Please set
the suction nozzle's bottom dead point on the upper
surface of the board.
3. Soldering
Flux Application
Do not use strong acidic flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
4. Cleaning
Please confirm there is no problem in the reliability of the
product beforehand when cleaning it with the intended
equipment.
The residue after cleaning it might cause a decrease in
the surface resistance of the chip and the corrosion of the
electrode part, etc. As a result it might cause reliability to
deteriorate. Please confirm beforehand that there is no
problem with the intended equipment in ultrasonic
cleansing.
214
5. Resin Coating
Please use it after confirming there is no influence on the
product with the intended equipment before the resin
coating and molding.
A cracked chip might be caused at the cooling/heating
cycle by the amount of resin spreading and/or bias
thickness.
The resin for coating and molding must be selected as
the stress is small when stiffening and the hygroscopic is
low as possible.