GR442QR7LB102KW01L Datasheet, PDF (230/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution
Continued from the preceding page.
Soldering and Mounting
1. Vibration and Impact
Do not expose a capacitor to excessive shock or vibration
during use.
Do not directly touch the capacitor, especially the ceramic
body. Residue from hands/fingers may create a short
circuit environment.
C02E.pdf
Oct.1,2012
2. Land Layout for Cropping PC Board
Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
<Example
to be avoided>
<Example
of improvement>
Locate chip
horizontal to the
direction in which
stress acts.
[Chip Mounting Close to Board Separation Point]
Perforation
C
B
D
A
Slit
Chip arrangement
Worst AGCGB~D Best
3. Reflow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. In order to prevent mechanical
damage, preheating is required for both the components
and the PCB board. Preheating conditions are shown in
Table 1. It is required to keep the temperature differential
between the soldering and the components surface (ΔT)
as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(ΔT) between the component and solvent within the
range shown in the Table 1.
Table 1
Part Number
K--31
K--55
Temperature Differential
ΔTV190D
ΔTV130D
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature 230-250°C 230-240°C
240-260°C
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature (D)
Peak Temperature
200°C
ΔT
170°C
150°C
130°C
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature (D)
Peak Temperature
ΔT
170°C
150°C
130°C
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 20 seconds max.
Continued on the following page.
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