GR442QR7LB102KW01L Datasheet, PDF (136/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
For General
!Caution/Notice
C02E.pdf
Oct.1,2012
!Caution
Notice
c Storage and Operation Conditions ^{........................} 119
c Rating ^{....................................................................} 119
1. Temperature Dependent Characteristics........... 119
2. Measurement of Capacitance............................ 120
3. Applied Voltage ^{.................................................} 120
4. Applied Voltage and
Self-heating Temperature.................................. 120
5. DC Voltage and AC Voltage Characteristic ^....... 121
6. Capacitance Aging ^{............................................} 121
7. Vibration and Shock ^{..........................................} 122
c Soldering and Mounting ^{........................................} 122
1. Mounting Position ^{..............................................} 122
2. Information before Mounting.............................. 123
3. Maintenance of the Mounting (pick and place)
Machine ^{.............................................................} 123
4-1. Reflow Soldering ^{............................................} 124
4-2. Flow Soldering................................................ 125
4-3. Correction with a Soldering Iron ^{.....................} 126
4-4. Leaded Component Insertion ^{.........................} 126
5. Washing............................................................. 126
6. Electrical Test on Printed Circuit Board............. 127
7. Printed Circuit Board Cropping.......................... 127
c Rating ^{....................................................................} 129
1. Operating Temperature ^{.....................................} 129
2. Atmosphere Surroundings................................. 129
3. Piezo-electric Phenomenon............................... 129
c Soldering and Mounting ^{........................................} 129
1. PCB Design ^{.......................................................} 129
1. Notice for Pattern Forms ^{...............................} 129
2. Land Dimensions........................................... 130
2. Adhesive Application ^{.........................................} 131
3. Adhesive Curing ^{................................................} 132
4. Flux Application ^{.................................................} 132
5. Flow Soldering................................................... 132
6. Washing............................................................. 132
7. Coating ^{..............................................................} 133
8. Die Bonding/Wire Bonding
(GMA or GMD Series) ^{.......................................} 133
c Others.................................................................... 133
1. Transportation ^{...................................................} 133
c Others.................................................................... 128
1. Under Operation of Equipment.......................... 128
2. Others................................................................ 128
118