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| GR442QR7LB102KW01L Datasheet, PDF (151/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors | |||
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!Note ⢠Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
⢠This catalog has only typical speciï¬cations. Therefore, please approve our product speciï¬cations or transact the approval sheet for product speciï¬cations before ordering.
C02E.pdf
Oct.1,2012
Continued from the preceding page.
7. Coating
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with low curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and the
capacitor may cause the destruction and deterioration of
the capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
Notice
Select a resin for which the thermal expansion coefficient
is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
8. Die Bonding/Wire Bonding (GMA or GMD Series)
1. Die Bonding of Capacitors
s 5SE THE FOLLOWING MATERIALS FOR THE "RAZING ALLOYS
Au-Sn (80/20) 300 to 320 °C in N2 atmosphere
s -OUNTING
(1) Control the temperature of the substrate so it
MATCHES THE TEMPERATURE OF THE BRAZING ALLOY
0LACE THE BRAZING ALLOY ON THE SUBSTRATE AND PLACE
the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.
2. Wire Bonding
s 7IRE
'OLD WIRE MICRO M INCH DIAMETER
s "ONDING
(1) Thermo compression, ultrasonic ball bonding.
2EQUIRED STAGE TEMPERATURE TO #
2EQUIRED WEDGE OR CAPILLARY WEIGHT . TO .
(4) Bond the capacitor and base substrate or other
devices with gold wire.
c Others
1. Transportation
1. The performance of a capacitor may be affected by the
conditions during transportation.
1-1. The capacitors shall be protected against
excessive temperature, humidity and mechanical
force during transportation.
(1) Climatic condition
s LOW AIR TEMPERATURE
#
s CHANGE OF TEMPERATURE AIRAIR
# #
s LOW AIR PRESSURE K0A
s CHANGE OF AIR PRESSURE K0AMIN
-ECHANICAL CONDITION
Transportation shall be done in such a way that
the boxes are not deformed and forces are not
directly passed on to the inner packaging.
1-2. Do not apply excessive vibration, shock, and
pressure to the capacitor.
(1) When excessive mechanical shock or pressure
is applied to a capacitor, chipping or cracking
may occur in the ceramic body of the capacitor.
(2) When the sharp edge of an air driver, a
SOLDERING IRON TWEEZERS A CHASSIS ETC
impacts strongly on the surface of the capacitor,
the capacitor may crack and short-circuit.
1-3. Do not use a capacitor to which excessive shock
was applied by dropping, etc.
A capacitor dropped accidentally during
processing may be damaged.
133
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