GR442QR7LB102KW01L Datasheet, PDF (220/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
KRM Series Specifications and Test Methods
Continued from the preceding page.
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««i>À>˜Vi No defects or abnormalities
>«>VˆÌ>˜Vi Within the specified tolerance
11
6ˆLÀ>̈œ˜Ê
,iÈÃÌ>˜Vi
D.F.
In accordance with item No.7
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Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 min. This motion should
be applied for a period of 2 hrs. in each of 3 mutually
perpendicular directions (total of 6 hrs.).
12 iviV̈œ˜
No marking defects
/Þ«i
KRM31
KRM55
b
d
c
ø4.5
a
100
t : 1.6
(in mm)
ˆ“i˜Ãˆœ˜Ê­““®
>
L
V
`
2.2
5.0
1.65
1.0
4.5
8.0
5.6
1.0
Fig. 2
13
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/iÀ“ˆ˜>̈œ˜
The metal surface is soldered well
Glass Epoxy Board
Solder Resist
Cu
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
20 ⁵⁰
speed: 1.0mm/s
R4
Pressurize
Flexure: V5
Capacitance meter
45
45
Fig. 3
(in mm)
Reflow Soldering: Peak 260+0/-5°C
The area of soldering 230°C min., 20 to 40 s
Let sit for 24±2 h at room condition,* then measure.
U*ÀiÌÀi>̓i˜Ì
Perform the heat treatment at 150+0/-10°C for 60±5 min. and
then let sit for 24±2 h at room condition. (*1)
300°C
200°C
100°C
180°C
150°C
20 to 40 s
60 to 120 s
260+0/-5°C
230°C min.

««i>À>˜Vi No marking defects
>«>VˆÌ>˜ViÊ
…>˜}i
Within ±10%
,iÈÃÌ>˜ViÊ
14 ̜Ê-œ`iÀˆ˜}Ê <sup>D.F.</sup>
In accordance with item No.7
i>Ì
°,°
In accordance with item No.5
ˆiiVÌÀˆVÊ
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In accordance with item No.4
U˜ÊV>ÃiʜvÊ,ivœÜÊ-œ`iÀˆ˜}
See item 13 Solderability of termination
U˜ÊV>ÃiʜvÊ-œ`iÀˆ˜}ÊÀœ˜
Temp. of solder: 350±10°C
Solder time: 4+1/-0 s
Let sit for 24±2 hrs.at room condition,* then measure
Please refer to "Caution (Soldering and Mounting) Correction
with a Soldering Iron"
(*1) "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
202