GR442QR7LB102KW01L Datasheet, PDF (206/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
!Caution/Notice
C02E.pdf
Oct.1,2012
!Caution
Notice
c Storage and Operation Conditions ^{........................} 189
c Rating ^{....................................................................} 189
1. Operating Voltage.............................................. 189
2. Operating Temperature, Self-generated Heat,
and Load Reduction at High-frequency Voltage
Condition ........................................................... 189
3. Fail-safe............................................................. 191
4. Test Condition for AC Withstanding Voltage ^..... 191
(1) Test Equipment ^{............................................} 191
(2) Voltage Applied Method ^{...............................} 191
c Soldering and Mounting ^{........................................} 191
1. Vibration and Impact.......................................... 191
2. Circuit Board Material ^{........................................} 191
3. Land Layout for Cropping PC Board ^{.................} 191
4. Reflow Soldering ^{...............................................} 192
5. Flow Soldering................................................... 193
6. Correction with a Soldering Iron ^{........................} 194
7. Washing............................................................. 194
8. Handling ^{............................................................} 194
c Rating ^{....................................................................} 195
1. Capacitance Change of Capacitor..................... 195
2. Performance Check by Equipment.................... 195
c Soldering and Mounting ^{........................................} 195
1. Construction of Board Pattern ^{...........................} 195
2. Mounting of Chips.............................................. 196
3. Soldering ^{...........................................................} 197
(1) Limit of losing effective area of the
terminations and conditions needed
for soldering. ................................................ 197
(2) Flux Application............................................ 197
(3) Solder........................................................... 197
4. Cleaning ^{............................................................} 197
5. Resin Coating ^{....................................................} 197
188