GR442QR7LB102KW01L Datasheet, PDF (197/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
GA3 Series Specifications and Test Methods
Continued from the preceding page.
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««i>À>˜Vi No defects or abnormalities
>«>VˆÌ>˜Vi Within the specified tolerance
12
6ˆLÀ>̈œ˜Ê
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Q
…>À°
X7R
SL
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D.F.V0.025
QU400+20C*² (CF30pF)
QU1000
(CU30pF)
/iÃÌÊi̅œ`
Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each of 3 mutually perpendicular
directions (total of 6 hrs.).
Glass Epoxy Board
Solder resist
Cu
13 iviV̈œ˜
No marking defects
b
ø4.5
d
c
a
100
Fig. 2
t : 1.6
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
LZW
ˆ“i˜Ãˆœ˜Ê­““®
­““®
>
L
V
`
4.5Z2.0
3.5
7.0
2.4
4.5Z3.2
3.5
5.7Z2.8
4.5
7.0
8.0
3.7
3.2
1.0
5.7Z5.0
4.5
8.0
5.6
Flexure=1
Capacitance meter
45
45
(in mm)
Fig. 3
14
-œ`iÀ>LˆˆÌÞʜvÊ
/iÀ“ˆ˜>̈œ˜
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder

««i>À>˜Vi No marking defects
…>À°
>«>VˆÌ>˜ViÊ …>˜}i
>«>VˆÌ>˜ViÊ
X7R
Within ±10%
…>˜}i
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SL
Within ±2.5% or ±0.25pF
(Whichever is larger)
15 ̜Ê-œ`iÀˆ˜}Ê
i>Ì
°,°
More than 1,000MΩ
ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
Preheat the capacitor as in table. Immerse the capacitor in
solder solution at 260±5°C for 10±1 sec. Let sit at room
condition*<sup>1</sup> for 24±2 hrs., then measure.
U““iÀȘ}Êëii`: 25±2.5mm/s
U*ÀiÌÀi>̓i˜ÌÊvœÀÊ8Ç,ÊV…>À°
Perform a heat treatment at 150Y ^W10 ⁰°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*¹
**Ài…i>̈˜}
-Ìi«
1
2
/i“«iÀ>ÌÕÀi
100 to 120°C
170 to 200°C
/ˆ“i
1 min.
1 min.
*1 "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
Continued on the following page.
179