GR442QR7LB102KW01L Datasheet, PDF (224/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
KR3 Series Specifications and Test Methods
Continued from the preceding page.
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No marking defects
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12 iviV̈œ˜
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KR355
b
ø4.5
d
c
a
100
t : 1.6
(in mm)
ˆ“i˜Ãˆœ˜Ê­““®
>
L
c
`
4.5
8.0
5.6
1.0
Fig. 2
13
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The metal surface is soldered well.
/iÃÌÊi̅œ`
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
20 ⁵⁰
speed: 1.0mm/s
R4
Pressurize
Flexure: V5
Capacitance meter
45
45
Fig. 3
(in mm)
Reflow Soldering: Peak 260+0/-5°C
The area of soldering 230°C min., 20 to 40 sec.
Let sit for 24±2 hrs. at room condition*, then measure.
U*ÀiÌÀi>̓i˜Ì
Perform the heat treatment at 150+0/-10°C for 60±5 min. and
then let sit for 24±2 hrs. at room condition.*
300°C
200°C
100°C
180°C
150°C
20 to 40 s
60 to 120 s
260+0/-5°C
230°C min.

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…>˜}i
Within ±10%
,iÈÃÌ>˜ViÊ
14 ̜Ê-œ`iÀˆ˜}Ê ^D.F.
In accordance with item No.7
i>Ì
I.R.
In accordance with item No.5
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In accordance with item No.4

««i>À>˜Vi No marking defects
>«>VˆÌ>˜ViÊ
…>˜}i
Within ±7.5%
D.F.
In accordance with item No.7
I.R.
In accordance with item No.5
15
/i“«iÀ>ÌÕÀiÊ
ÞVi
ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
U˜ÊV>ÃiʜvÊ,ivœÜÊ-œ`iÀˆ˜}
See item 13 Solderability of Termination
U˜ÊV>ÃiʜvÊ-œ`iÀˆ˜}ÊÀœ˜
Temp. of solder: 350±10°C
Solder time: 4+1/-0 sec.
Let sit for 24±2 hrs.at room condition,* then measure.
Please refer to "Caution (Soldering and Mounting) Correction
with a Soldering Iron".
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 100 cycles according to the 4 heat treatments listed
in the following table.
Let sit for 24±2 hrs. at room condition*, then measure.
-Ìi«
1
2
3
4
/i“«iÀ>ÌÕÀiÊ­c ®
Min. Operating Temp. ±3
Room Temp.
Min. Operating Temp. ±2
Room Temp.
/ˆ“iÊ­“ˆ˜°®
30±3
2 to 3
30±3
2 to 3
U*ÀiÌÀi>̓i˜Ì
Perform a heat treatment at 150+0/-10°C for 60±5 min. and
then let sit for 24±2 hrs. at room condition.*
Glass Epoxy Board
Fig. 4
Solder
Cu
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
206