GR442QR7LB102KW01L Datasheet, PDF (214/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Notice
Continued from the preceding page.
Dimensions of Slit (Example)
Chip Capacitor
Slit
Solder Resist
d
e
Land
L
W
Preparing the slit helps flux cleaning and resin
coating on the back of the capacitor.
However, the length of the slit design should
be as short as possible to prevent mechanical
damage in the capacitor.
A longer slit design might receive more severe
mechanical stress from the PCB.
Recommended slit design is shown in the
Table.
LgW
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
d
-
-
1.0-2.0
1.0-2.0
1.0-2.8
1.0-2.8
1.0-4.0
1.0-4.0
e
-
-
3.2-3.7
4.1-4.6
3.6-4.1
4.8-5.3
4.4-4.9
6.6-7.1
(in mm)
C02E.pdf
Oct.1,2012
Land Layout to Prevent Excessive Solder
Mounting Close to a Chassis
d1
Chassis
Solder (Ground solder)
Examples
to Be Avoided
Adhesive
Base board
Land Pattern
in section
Examples of
Improvements
by the Land
Division
d2
d1<d2
Solder Resist
in section
Mounting with Leaded Components
Lead Wire Connected
to a Part Provided
with Lead Wires.
Mounting Leaded Components Later
Soldering Iron
Lead Wire of
Component to be
Connected Later.
in section
Solder Resist
Solder Resist
in section
in section
in section
2. Mounting of Chips
Thickness of adhesives applied
Keep thickness of adhesives applied (50-105μm or more)
to reinforce the adhesive contact considering the
thickness of the termination or capacitor (20-70μm) and
the land pattern (30-35μm).
Mechanical shock of the chip placer
When the positioning claws and pick-up nozzle are worn,
the load is applied to the chip while positioning is
concentrated in one position, thus causing cracks,
breakage, faulty positioning accuracy, etc.
Careful checking and maintenance are necessary to
prevent unexpected trouble.
An excessively low bottom dead point of the suction
nozzle imposes great force on the chip during mounting,
causing cracked chips. Please set the suction nozzle's
bottom dead point on the upper surface of the board.
196
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