GR442QR7LB102KW01L Datasheet, PDF (213/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
Notice
Rating
1. Capacitance Change of Capacitor
(1) In the case of X7R, X7T char.
Capacitors have an aging characteristic, whereby
the capacitor continually decreases its
capacitance slightly if the capacitor is left on
for a long time. Moreover, capacitance might change
greatly depending on the surrounding temperature
or an applied voltage. Therefore, it is not likely
to be suitable for use in a time constant circuit.
Please contact us if you need detailed information.
(2) In the case of any char. except X7R, X7T
Capacitance might change a little depending on the
surrounding temperature or an applied voltage.
Please contact us if you intend to use this product
in a strict time constant circuit.
2. Performance Check by Equipment
Before using a capacitor, check that there is no
problem in the equipment's performance and the
specifications.
Generally speaking, CLASS 2 (X7R, X7T char.) ceramic
capacitors have voltage dependence characteristics
and temperature dependence characteristics in
capacitance. Therefore, the capacitance value may
change depending on the operating condition in the
equipment.
Accordingly, be sure to confirm the apparatus
performance of receiving influence in a capacitance
value change of a capacitor, such as leakage current
and noise suppression characteristics.
Moreover, check the surge-proof ability of a
capacitor in the equipment, if needed, because the
surge voltage may exceed the specific value by the
inductance of the circuit.
Soldering and Mounting
1. Construction of Board Pattern
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
Construction and Dimensions of Pattern (Example)
Chip Capacitor
c
Solder Resist
L
W
b
a
Land
Flow Soldering
LgW
a
b
c
1.6g0.8
0.6-1.0
0.8-0.9
0.6-0.8
2.0g1.25 1.0-1.2
0.9-1.0
0.8-1.1
3.2g1.6
2.2-2.6
1.0-1.1
1.0-1.4
Flow soldering: 3.2g1.6 or less available.
Reflow Soldering
LgW
a
1.6g0.8
0.6-0.8
2.0g1.25 1.0-1.2
3.2g1.6
2.2-2.4
3.2g2.5
2.0-2.4
4.5g2.0
2.8-3.4
4.5g3.2
2.8-3.4
5.7g2.8
4.0-4.6
5.7g5.0
4.0-4.6
b
0.6-0.7
0.6-0.7
0.8-0.9
1.0-1.2
1.2-1.4
1.2-1.4
1.4-1.6
1.4-1.6
c
0.6-0.8
0.8-1.1
1.0-1.4
1.8-2.3
1.4-1.8
2.3-3.0
2.1-2.6
3.5-4.8
(in mm)
Continued on the following page.
195