GR442QR7LB102KW01L Datasheet, PDF (160/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

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• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
GRM Series Specifications and Test Methods
Continued from the preceding page.
No.
Item
-«iVˆvˆV>̈œ˜Ã
No marking defects
b
ø4.5
d
c
11 Deflection
a
100
t : 1.6
Fig. 2
LZW
ˆ“i˜Ãˆœ˜Ê­““®
(mm)
a
b
c
d
2.0Z1.25
1.2
4.0
1.65
3.2Z1.6
2.2
5.0
2.0
3.2Z2.5
2.2
4.5Z2.0
3.5
5.0
7.0
2.9
2.4
1.0
4.5Z3.2
3.5
7.0
3.7
5.7Z5.0
4.5
8.0
5.6
12
Solderability of
Termination
75% of the terminations are to be soldered evenly
and continuously.
Appearance No marking defects
Capacitance
Change
,iÈÃÌ>˜ViÊ
13 to Soldering ^Q
Heat
I.R.
Within ±2.5%
1,000 min.
More than 10,000MΩ
Dielectric
Strength
In accordance with item No.4
Appearance No marking defects
Capacitance
Change
Within ±2.5%
Q
500 min.
I.R.
More than 10,000MΩ
14
Temperature
Cycle
/iÃÌÊi̅œ`
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
R230
20 <sup>50 Pressurizing</sup>
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
(in mm)
Fig. 3
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in
solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
Preheat the capacitor at 120 to 150°C<sup>*</sup> for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1 sec.
Let sit at room condition* for 24±2 hrs., then measure.
U““iÀȘ}Êëii`: 25±2.5mm/s
*Preheating for more than 3.2Z2.5mm
Step
1
2
Temperature
100 to 120°C
170 to 200°C
Time
1 min.
1 min.
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
Step
1
2
3
4
Temperature (°C)
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
Time (min.)
30±3
2 to 3
30±3
2 to 3
Dielectric
Strength
In accordance with item No.4
Glass Epoxy Board
Fig. 4
Solder resist
Cu
Appearance No marking defects
Capacitance
Humidity ^Change
15 (Steady Q
State)
I.R.
Within ±5.0%
350 min.
More than 1,000MΩ
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500^W Y²⁴⁰ hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
16 Life
Dielectric
Strength
In accordance with item No.4
Appearance No marking defects
Capacitance
Change
Within ±3.0%
Q
350 min.
I.R.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Apply voltage as in Table for 1,000^W Y⁴⁸ 0hrs. at maximum
operating temperature ±3°C.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
Rated Voltage
DC250V
DC630V, DC1kV,
DC2kV, DC3.15kV
Applied Voltage
150% of the rated voltage
120% of the rated voltage
The charge/discharge current is less than 50mA.
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
142