GR442QR7LB102KW01L Datasheet, PDF (211/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
Continued from the preceding page.
5. Flow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. Additionally, an excessively long
soldering time or high soldering temperature results in
leaching by the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in Table 2. It is required
to keep temperature differential between the soldering
and the components surface (ΔT) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
Table 2
Part Number
G--18/21/31
Temperature Differential
ΔTV150D
Recommended Conditions
Peak Temperature
Atmosphere
Pb-Sn Solder
240-250°C
Air
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Lead Free Solder
250-260°C
N2
!Caution
[Standard Conditions for Flow Soldering]
Temperature (D)
Peak Temperature
ΔT
Soldering
Gradual
Cooling
170°C
150°C
130°C
Preheating
Time
60-120 seconds 5 seconds max.
[Allowable Soldering Temperature and Time]
270
260
250
240
230
0
10
20
30
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Optimum Solder Amount for Flow Soldering
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively large, the risk of cracking is higher during
board bending or under any other stressful conditions.
Up to Chip Thickness
Adhesive
in section
Continued on the following page.
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