GR442QR7LB102KW01L Datasheet, PDF (215/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
Continued from the preceding page.
3. Soldering
(1) Limit of losing effective area of the terminations and
conditions needed for soldering.
Depending on the conditions of the soldering
temperature and/or immersion (melting time),
effective areas may be lost in some parts of the
terminations.
To prevent this, be careful in soldering so that any
possible loss of the effective area on the terminations
will securely remain at a maximum of 25% on all
edge length A-B-C-D-A of part with A, B, C, D, shown
in the Figure below.
A
B
C
D
Termination
Notice
(2) Flux Application
An excessive amount of flux generates a large quantity of
flux gas, causing deteriorated solderability. So apply flux
thinly and evenly throughout. (A foaming system is
generally used for flow soldering.)
Flux containing too high a percentage of halide may
cause corrosion of the outer electrodes without sufficient
cleaning. Use flux with a halide content of 0.2% max.
Do not use strong acidic flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
(3) Solder
The use of Sn-Zn based solder will deteriorate the
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
4. Cleaning
Please confirm there is no problem in the reliability of the
product beforehand when cleaning it with the intended
equipment.
The residue after cleaning it might cause a decrease in
the surface resistance of the chip and the corrosion of the
electrode part, etc. As a result it might cause reliability to
deteriorate. Please confirm beforehand that there is no
problem with the intended equipment in ultrasonic
cleansing.
5. Resin Coating
Please use it after confirming there is no influence on the
product with the intended equipment before the resin
coating and molding.
A cracked chip might be caused at the cooling/heating
cycle by the amount of resin spreading and/or bias
thickness.
The resin for coating and molding must be selected as
the stress is small when stiffening and the hygroscopic is
low as possible.
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