GR442QR7LB102KW01L Datasheet, PDF (231/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
Continued from the preceding page.
Optimum Solder Amount for Reflow Soldering
If solder paste is excessive, solder between a chip and a
metal terminal melts. This causes the chip to move and
come off.
If solder paste is too little, it causes a lack of adhesive
strength on the metal terminal and the capacitor comes
off.
Please make sure that solder is smoothly applied higher
than 0.3mm and lower than the level of the bottom of the
chip.
!Caution
[Optimum Solder Amount for Reflow Soldering]
in section
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
4. Flow Soldering
Do not apply flow soldering.
5. Correction with a Soldering Iron
Please refer to the figure of a soldering iron on the right.
Please use thread solder which is smaller than 0.5mm in
diameter.
A soldering iron must be touched the bottom of metal
terminal.
*1) Do not touch ceramic, or it causes cracks because of
sudden heat.
*2) Do not touch the connection between a chip and a
metal and the outside of that area, or it causes the
chip to move and come off.
17
26
R0.5
Soldering Iron
(in mm)
Temperature of iron chip: 350°C max./5s max./60W max.
Electrode Land
Thread Solder
Please only touch the metal terminal.
Do not touch the chip.
Optimum Solder Amount when re-working Using a Solder
Iron.
The top of the solder fillet should be lower than the level
of the bottom of the chip.
[Optimum Solder Amount when Re-working Using
a Solder Iron]
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
CAUSE FUMING OR PARTIAL DISPERSION WHEN THE
PRODUCT IS USED.
in section
213