GR442QR7LB102KW01L Datasheet, PDF (149/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Continued from the preceding page.
GNMpp2
Chip Capacitor
a
c
p
b
Land
GNMpp4
LLA
Chip Capacitor
a
b
c
p
Land
C02E.pdf
Oct.1,2012
Notice
Table 3 GNM, LLA Series for Reflow Soldering Land Dimensions
Part Number
GNM0M2
GNM1M2
GNM212
GNM214
Dimensions (mm)
L
W
a
b
0.9
0.6
0.12 to 0.20*
0.35 to 0.40*
1.37
1.0
0.4 to 0.5
0.35 to 0.45
2.0
1.25
0.6 to 0.7
0.5 to 0.7
2.0
1.25
0.6 to 0.7
0.5 to 0.7
GNM314
LLA18
LLA21
LLA31
3.2
1.6
0.8 to 1.0
0.7 to 0.9
1.6
0.8
0.3 to 0.4
0.25 to 0.35
2.0
1.25
0.5 to 0.7
0.35 to 0.6
3.2
1.6
0.7 to 0.9
0.4 to 0.7
* 0.82Va+2bV1.00
c
0.3
0.3 to 0.35
0.4 to 0.5
0.25 to 0.35
0.3 to 0.4
0.15 to 0.25
0.2 to 0.3
0.3 to 0.4
LLM
ea
p
c
b
Chip Capacitor
c'
b'
f
d
Table 4 LLM Series for Reflow Soldering Land Dimensions
Part Number
LLM21
LLM31
a
0.6 to 0.8
1.0
b, b'
(0.3 to 0.5)
(0.3 to 0.5)
b=(c-e)/2, b'=(d-f)/2
c, c'
0.3
0.4
Dimensions (mm)
d
e
2.0 to 2.6
1.3 to 1.8
3.2 to 3.6
1.6 to 2.0
f
1.4 to 1.6
2.6
p
0.45
0.64
1.0
0.5
0.8
0.4
0.5
0.8
p
0.5
0.8
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa s s (500ps) min. (at 25°C).
3. Adhesive Coverage
Part Number
Adhesive Coverage*
GRM18, GQM18
0.05mg min.
GRM21, LLL21, GQM21
0.1mg min.
GRM31, LLL31
0.15mg min.
*Nominal Value
Board
Chip Capacitor
Adhesive
Land
a=20 to 70μm
b=30 to 35μm
c=50 to 105μm
a
c
b
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