GR442QR7LB102KW01L Datasheet, PDF (164/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
GRM Series Specifications and Test Methods
Continued from the preceding page.
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-«iVˆvˆV>̈œ˜Ã
/iÃÌÊi̅œ`
No marking defects
b
ø4.5
d
c
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
11 iviV̈œ˜
a
100
t : 1.6
Fig. 2
LZW
ˆ“i˜Ãˆœ˜Ê­““®
­““®
>
L
V
`
1.6Z0.8
1.0
3.0
1.2
2.0Z1.25
1.2
4.0
1.65
3.2Z1.6
2.2
3.2Z2.5
2.2
5.0
2.0
5.0
2.9
1.0
4.5Z3.2
3.5
7.0
3.7
5.7Z5.0
4.5
8.0
5.6
R230
20 <sup>50 Pressurizing</sup>
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
Fig. 3
(in mm)
12
-œ`iÀ>LˆˆÌÞʜvÊ
/iÀ“ˆ˜>̈œ˜
75% of the terminations are to be soldered evenly and continuously.

««i>À>˜Vi No marking defects
>«>VˆÌ>˜ViÊ
…>˜}i
Within ±10%
D.F.
,iÈÃÌ>˜ViÊ
13 ̜Ê-œ`iÀˆ˜}Ê <sub>I.R.</sub>
i>Ì
0.025 max.
CU0.01μF: More than 100MΩs—&
CF0.01μF: More than 10,000MΩ
ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
Preheat the capacitor at 120 to 150°C<sup>*</sup> for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
U““iÀȘ}Êëii`\Ê25±2.5mm/s
U*ÀiÌÀi>̓i˜Ì
Perform a heat treatment at 150⁺ –10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
*Preheating for more than 3.2Z2.5mm
-Ìi«
1
2
/i“«iÀ>ÌÕÀi
100 to 120°C
170 to 200°C
/ˆ“i
1 min.
1 min.

««i>À>˜Vi No marking defects
>«>VˆÌ>˜ViÊ
…>˜}i
Within ±7.5%
D.F.
0.025 max.
I.R.
CU0.01μF: More than 100MΩs—&
CF0.01μF: More than 10,000MΩ
14
/i“«iÀ>ÌÕÀiÊ
ÞVi
ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
-Ìi«
1
2
3
4
/i“«iÀ>ÌÕÀiÊ­c ®
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
/ˆ“iÊ­“ˆ˜°®
30±3
2 to 3
30±3
2 to 3
U*ÀiÌÀi>̓i˜Ì
Perform a heat treatment at 150⁺ –10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Glass Epoxy Board
Fig. 4
Solder resist
Cu

««i>À>˜Vi No marking defects
>«>VˆÌ>˜ViÊ
…>˜}i
Within ±15%
15
Փˆ`ˆÌÞÊ
­-Ìi>`ÞÊ
D.F.
0.05 max.
-Ì>Ìi®
I.R.
CU0.01μF: More than 10MΩs—&
CF0.01μF: More than 1,000MΩ
ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500^+–240hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
U*ÀiÌÀi>̓i˜Ì
Perform a heat treatment at 150⁺ –10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
146