GR442QR7LB102KW01L Datasheet, PDF (143/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
Continued from the preceding page.
4-2. Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating
should be required for both of the components and the
PCB board.
Preheating conditions are shown in table 2. It is required
to keep the temperature differential between the solder
and the component's surface (ΔT) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance
value due to loss of contact between electrodes and end
termination.
3. When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(ΔT) between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to chips not listed in table 2.
Table 2
Part Number
GRM18/21/31
LLL21/31
GQM18/21
Temperature Differential
ΔTV150°C
!Caution
[Standard Conditions for Flow Soldering]
Temperature (D)
Soldering
Soldering
Peak
Temperature
Gradual
Cooling
ΔT
Preheating
Peak
Temperature
Preheating
30-90 seconds
Time
5 seconds max.
[Allowable Flow Soldering Temperature and Time]
280
270
260
250
240
230
220
0
10
20
30
40
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder
Preheating Peak Temperature 90 to 110°C
Soldering Peak Temperature 240 to 250°C
Atmosphere
Air
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Lead Free Solder
100 to 120°C
250 to 260°C
N2
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during board
bending or any other stressful condition.
Up to Chip Thickness
Adhesive
in section
Continued on the following page.
125