GR442QR7LB102KW01L Datasheet, PDF (189/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
GA2 Series Specifications and Test Methods
Continued from the preceding page.
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b
d
c
ø4.5
a
100
Fig. 2
t : 1.6
/iÃÌÊi̅œ`
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
LZW
ˆ“i˜Ãˆœ˜Ê­““®
­““®
>
L
c
`
4.5Z2.0
3.5
7.0
2.4
4.5Z3.2
3.5
7.0
3.7
1.0
5.7Z5.0
4.5
8.0
5.6
Flexure=1
Capacitance meter
45
45
(in mm)
Fig. 3
13
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/iÀ“ˆ˜>̈œ˜
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder

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D.F.
I.R.
Within ±15%
0.05 max.
More than 1,000MΩ
The capacitor should be subjected to 40±2°C, relative humidity of
90 to 98% for 8 hrs., and then removed in room condition* for 16
hrs. until 5 cycles.
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In accordance with item No.4

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Within ±10%
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15 ̜Ê-œ`iÀˆ˜}Ê I.R.
i>Ì
0.025 max.
More than 2,000MΩ
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
U““iÀȘ}Êëii`: 25±2.5mm/s
U*ÀiÌÀi>̓i˜Ì
Perform a heat treatment at 150^W Y10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
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ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
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1
2
/i“«iÀ>ÌÕÀi
100 to 120°C
170 to 200°C
/ˆ“i
1 min.
1 min.

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>«>VˆÌ>˜ViÊ
…>˜}i
Within ±15%
D.F.
0.05 max.
I.R.
More than 2,000MΩ
16
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ˆiiVÌÀˆVÊ
-ÌÀi˜}̅
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
-Ìi«
1
2
3
4
/i“«iÀ>ÌÕÀiÊ­c ®
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
/ˆ“iÊ­“ˆ˜°®
30±3
2 to 3
30±3
2 to 3
U*ÀiÌÀi>̓i˜Ì
Perform a heat treatment at 150^W Y10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Glass Epoxy Board
Fig. 4
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Solder resist
Cu
Continued on the following page.
171