GR442QR7LB102KW01L Datasheet, PDF (212/237 Pages) Murata Manufacturing Co., Ltd. – chip monolithic ceramic capacitors

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
C02E.pdf
Oct.1,2012
!Caution
Continued from the preceding page.
6. Correction with a Soldering Iron
When sudden heat is applied to the components by use
of a soldering iron, the mechanical strength of the
components will decrease because the extreme
temperature change causes deformations inside the
components.
In order to prevent mechanical damage to the
components, preheating is required for both the
components and the PCB board.
Preheating conditions, (The "Temperature of the
Soldering Iron Tip", "Preheating Temperature,"
"Temperature Differential" between iron tip and the
components and the PCB), should be within the
conditions of table 3.
It is required to keep the temperature differential between
the soldering Iron and the component's surface (ΔT) as
small as possible.
After soldering, do not allow the component/PCB to cool
down rapidly.
The operating time for the re-working should be as short
as possible. When re-working time is too long, it may
cause solder leaching, in turn causing a reduction of the
adhesive strength of the terminations.
Table 3
Part Number
G--18/21/31
Temperature
of Soldering
Iron Tip
Preheating
Temperature
Temperature
Differential
(ΔT)
Atmosphere
350°C max. 150°C min. ΔTV190D
air
G--32/42/43/
52/55
280°C max. 150°C min.
ΔTV130D
air
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Optimum Solder Amount when re-working Using a
Soldering Iron
For sizes smaller than Gpp18, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component or 0.5mm whichever is smaller.
For sizes larger than Gpp21, the top of the solder fillet
should be lower than 2/3 of the thickness of the
component.
If the solder amount is excessive, the risk of cracking is
higher during board bending or under any other stressful
conditions.
A Soldering iron ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from
touching the components during the re-work.
Solder wire with ø0.5mm or smaller is required for
soldering.
Solder Amount
in section
7. Washing
Excessive output of ultrasonic oscillation during cleaning
causes PCBs to resonate, resulting in cracked chips or
broken solder. Take note not to vibrate PCBs.
8. Handling
Do not directly touch the chip capacitor, especially the
ceramic body. Residue from hands/fingers may create a
short circuit environment.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT AND
FUMING WHEN THE PRODUCT IS USED.
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