MC68HC705P9 Datasheet, PDF (142/156 Pages) Motorola, Inc – HCMOS Microcontroller Unit

Specifications _{Test Load}
Test Load
TEST POINT
V_DD
R2
C
R1
PINS
PA7–PA0
PB7/SCK–PB5/SDO
PC7/V_RH–PC0
R1
R2
C
3.26 kΩ 2.38 kΩ 50 pF
Figure 5. Test Load
Mechanical Specifications
The MC68HC705P9 is available in the following packages:
• 710 — Plastic dual in-line package (PDIP)
• 733 — Ceramic dual in-line package (Cerdip)
• 751F — Small outline integrated circuit (SOIC)
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:
• Local Motorola Sales Office
• Motorola Mfax
– Phone [phone]
– EMAIL [e-mail]
• Worldwide Web (wwweb) at http://design-net.com
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
12-mc68hc705p9
142
Specifications
MOTOROLA