PIC17C7XX Datasheet, PDF (278/328 Pages) Microchip Technology – High-Performance 8-Bit CMOS EPROM Microcontrollers with 10-bit A/D

PIC17C7XX
Package Type: K04-049 68-Lead Plastic Leaded Chip Carrier (L) – Square
E1
E
# leads = n1
D D1
n 12
α
CH2 x 45°
CH1 x 45°
A3
R1
A1
L
A
32°
c
R2
B1
β
A2
B
p
D2
E2
Units
INCHES*
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
n
68
68
Pitch
e1
0.050
1.27
Overall Pack. Height
A
0.165
0.175
0.185
4.19
4.45
4.70
Shoulder Height
A1
0.095
0.103
0.110
2.41
2.60
2.79
Standoff
A2
0.017
0.025
0.032
0.43
0.62
0.81
Side 1 Chamfer Dim.
A3
0.021
0.026
0.031
0.53
0.66
0.79
Corner Chamfer (1)
CH1
0.035
0.045
0.055
0.89
1.14
1.40
Corner Chamfer (other) CH2
0.000
0.005
0.010
0.00
0.13
0.25
Overall Pack. Width
E1
0.985
0.990
0.995
25.02
25.15
25.27
Overall Pack. Length
D1
Molded Pack. Width
E^‡
Molded Pack. Length
D^‡
0.985
0.950
0.950
0.990
0.954
0.954
0.995
0.958
0.958
25.02
24.13
24.13
25.15
24.23
24.23
25.27
24.33
24.33
Footprint Width
E2
0.910
0.920
0.930
23.11
23.37
23.62
Footprint Length
D2
0.910
0.920
0.930
23.11
23.37
23.62
Pins along Width
n1
17
17
Lead Thickness
c
Upper Lead Width
B1^†
0.008
0.010
0.012
0.20
0.25
0.30
0.026
0.029
0.031
0.66
0.72
0.79
Lower Lead Width
B
0.015
0.018
0.021
0.38
0.46
0.53
Upper Lead Length
L
0.050
0.058
0.065
1.27
1.46
1.65
Shoulder Inside Radius R1
0.003
0.005
0.010
0.08
0.13
0.25
J-Bend Inside Radius
R2
0.015
0.025
0.035
0.38
0.64
0.89
Mold Draft Angle Top
α
Mold Draft Angle Bottom β
0
5
10
0
5
10
0
5
10
0
5
10
* _{Controlling Parameter.}
† _{Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”}
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
‡ _{Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not}
exceed 0.010" (0.254 mm) per side or 0.020" (0.508 mm) more than dimensions “D” or “E.”
DS30289A-page 278
© 1998 Microchip Technology Inc.